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Here's what a socket looks like for chip scale packages. Each one is custom made for a given chip package. A couple samples of the 0.4mm pitch Baochip CSP devices are laid out on the lower rim of the socket for size reference.

How does the chip get and out of the socket? Is it placed by hand in the bottom with a vacuum pickup tool? At first I thought maybe there might be a vacuum line off the top of the socket cover: the chip held directly to the pillar as it descended down. I assume not though.